Methods and Systems to Meet Technology Pattern Density Requirements of Semiconductor Fabrication Processes

Techniques, systems, and methods are provided for optimizing pattern density fill patterns for integrated circuits. The method includes adjusting an area of a scribe line and a density of dummy fill shapes in the adjusted scribe line, while maintaining an area of the die, to achieve a pattern densit...

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Hauptverfasser: CRUZ ALLAN O, GILL MICHELLE, MACDONNELL, II DAVID V, LANDIS HOWARD S, SAMUELS DONALD J, BICKFORD JEANNE P, YERDON ROGER J
Format: Patent
Sprache:eng
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