Methods and Systems to Meet Technology Pattern Density Requirements of Semiconductor Fabrication Processes

Techniques, systems, and methods are provided for optimizing pattern density fill patterns for integrated circuits. The method includes adjusting an area of a scribe line and a density of dummy fill shapes in the adjusted scribe line, while maintaining an area of the die, to achieve a pattern densit...

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Bibliographische Detailangaben
Hauptverfasser:	CRUZ ALLAN O, GILL MICHELLE, MACDONNELL, II DAVID V, LANDIS HOWARD S, SAMUELS DONALD J, BICKFORD JEANNE P, YERDON ROGER J
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS PHYSICS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	Techniques, systems, and methods are provided for optimizing pattern density fill patterns for integrated circuits. The method includes adjusting an area of a scribe line and a density of dummy fill shapes in the adjusted scribe line, while maintaining an area of the die, to achieve a pattern density associated with technology ground rules for a particular design of the die.