APPLYING WAFER BACKSIDE COATINGS TO SEMICONDUCTOR WAFERS

A method for coating a silicon wafer comprises depositing a coating onto the exposed side of the wafer such that the coating is deposited on the entire surface area of the exposed side of the wafer, reaching to the edge of the wafer. This method either reduces significantly or eliminates die-fly dur...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	RUATTA STEPHEN ALDO, GLEESON PAUL JAMES, WILLYBIRO FIDELIN N, WINSTER ANTHONY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for coating a silicon wafer comprises depositing a coating onto the exposed side of the wafer such that the coating is deposited on the entire surface area of the exposed side of the wafer, reaching to the edge of the wafer. This method either reduces significantly or eliminates die-fly during dicing of semiconductor wafers, and is effective for depositing thin layers, such as are needed for Al paste electrodes in solar cell fabrication.