LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS

[PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using th...

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA SEIJI, KAWAKUBO SATOSHI, SUGIMORI KENICHIRO, IRISAWA ATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	[PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material. [MEANS FOR SOLVING] 0.1 to 1.5% by weight of Cu, 0.01% by weight or more and less than 0.05% by weight of Co, 0.05 to 0.25% by weight of Ag, 0.001 to 0.008% by weight of Ge, and the remainder being Sn. This low silver lead-free solder alloy is blended with a pasty flux or molded in a liner form by using a solid or pasty flux as a core. [SELECTED FIGURE] FIG. 2