Electronic Assembly

An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIM SEONG CHOON, LEE MENG EE, ONG ENG CHUAN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.