THREE-DIMENSIONAL STACKED SEMICONDUCTOR INTEGRATED CIRCUIT AND CONTROL METHOD THEREOF

A three-dimensional stacked semiconductor integrated circuit including a plurality of stacked chips. The semiconductor integrated circuit is configured to simultaneously select the plurality of chips in response to an external command and an address, and to activate one of memory banks which are ali...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHUN DUK SU, KIM HYUN SEOK, LEE HYUNG DONG
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A three-dimensional stacked semiconductor integrated circuit including a plurality of stacked chips. The semiconductor integrated circuit is configured to simultaneously select the plurality of chips in response to an external command and an address, and to activate one of memory banks which are aligned on the same line in a vertical direction, among a plurality of memory banks included in the plurality of chips.