MULTILAYER WIRING BOARD

There is provided a multilayer wiring board, which has a board body formed with two opposite main surfaces and includes a first resin insulating layer, a second resin insulating layer laminated to the first resin insulating layer and a wiring pattern arranged between the first and second resin insul...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HIDA TOSHINORI, SATO HIRONORI, HIGO KAZUNAGA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	There is provided a multilayer wiring board, which has a board body formed with two opposite main surfaces and includes a first resin insulating layer, a second resin insulating layer laminated to the first resin insulating layer and a wiring pattern arranged between the first and second resin insulating layers with a first surface of the wiring pattern abutting the first resin insulating layer and a second surface of the wiring pattern abutting the second resin insulating layer. The multilayer wiring board is characterized in that the wiring pattern extends in a plane direction of the board body and is embedded in both of the first and second resin insulating layers.