Light Emitting Diode Package Structure and Manufacturing Method Thereof

Light Emitting Diode Package Structure and Manufacturing Method Thereof

A light emitting diode package structure is disclosed. The LED package structure includes a carrier, an LED chip, a first molding compound and a second molding compound. The LED chip is disposed on the carrier. The first molding compound overlays the LED chip, wherein the first molding compound is m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: HSIN CHIA-FEN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A light emitting diode package structure is disclosed. The LED package structure includes a carrier, an LED chip, a first molding compound and a second molding compound. The LED chip is disposed on the carrier. The first molding compound overlays the LED chip, wherein the first molding compound is mixed up with a fluorescent material. The second molding compound overlays the first molding compound.