MASTER MOLD MANUFACTURING METHOD AND MOLD STRUCTURE MANUFACTURING METHOD

Disclosed is a method of manufacturing a master mold having an uneven pattern which includes wide and narrow concave portions using a reactive ion etching process. The method is capable of manufacturing a master mold improved in the uniformity of concave portions of the uneven pattern by performing...

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Bibliographische Detailangaben
1. Verfasser:	NISHIMAKI KATSUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROGRAPHY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES HOLOGRAPHY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MATERIALS THEREFOR MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NANOTECHNOLOGY NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed is a method of manufacturing a master mold having an uneven pattern which includes wide and narrow concave portions using a reactive ion etching process. The method is capable of manufacturing a master mold improved in the uniformity of concave portions of the uneven pattern by performing a main etching step in which etching is performed, using an original plate which includes a processing target layer and a foundation layer, on the processing target layer using the foundation layer as an etch stop layer and an extra etching step in which etching is performed on the original plate degraded by the main etching step in the uniformity of concave portions in order to improve the uniformity using an etching gas which includes a first gas capable of etching the foundation layer and producing a deposit with a bias power of not greater than 15 W.