TEXTILE-TYPE ELECTRONIC COMPONENT PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MOUNTING THE SAME ON TEXTILE

A textile-type electronic component package includes a textile base; a textile-type electronic component and a plurality of conductive patterns having end contact points formed on the top surface of the textile base; a thermoplastic adhesive formed on the bottom surface of the textile base; a plural...

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Bibliographische Detailangaben
Hauptverfasser:	SON YONG KI, KIM BAESUN, KIM JI EUN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A textile-type electronic component package includes a textile base; a textile-type electronic component and a plurality of conductive patterns having end contact points formed on the top surface of the textile base; a thermoplastic adhesive formed on the bottom surface of the textile base; a plurality of mounting pads formed on the thermoplastic adhesive and facing the conductive patterns, respectively; and a plurality of via-hole-type coupling parts penetrating end contact points of the conductive patterns, the textile base, and the thermoplastic adhesive, and electrically coupling the mounting pads and the conductive patterns, wherein the via-hole-type coupling parts includes a bunch of via-holes filled with a conductive polymer.