CIRCUIT BOARD WITH ANCHORED UNDERFILL

Various circuit boards and methods of manufacturing using the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a solder mask to a side of a circuit board and forming at least one opening in the solder mask leading to the side. An underfill is placed on...

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Bibliographische Detailangaben
1. Verfasser:	TOPACIO RODEN R
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Various circuit boards and methods of manufacturing using the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a solder mask to a side of a circuit board and forming at least one opening in the solder mask leading to the side. An underfill is placed on the solder mask so that a portion thereof projects into the at least one opening.