Device and Method for Sawing Electronic Components

The invention relates to a device for separating electronic components, provided with: sawing means and positioning means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components. The invent...

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Bibliographische Detailangaben
Hauptverfasser:	HARMSEN WILHELMUS HENDRIKUS JOHANNES, IN 'T VELD FREDERIK HENDRIK, HERMANS MARK, ZWEERS JOHANNES GERHARDUS AUGUSTINUS
Format:	Patent
Sprache:	eng
Schlagworte:	CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HAND CUTTING TOOLS PERFORMING OPERATIONS SEVERING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	The invention relates to a device for separating electronic components, provided with: sawing means and positioning means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components. The invention further comprises a separating device for electronic components, provided with: sawing means, inspection means, and sorting means, wherein between the inspection means and the sorting means at least one transfer position is defined for the purpose of transferring separated electronic components. Finally, the invention also relates to a method for separating electronic components.