STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS

A structure to prevent propagation of a crack into the active region of a 3D integrated circuit, such as a crack initiated by a flaw at the periphery of a thinned substrate layer or a bonding layer, and methods of forming the same is disclosed.

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Bibliographische Detailangaben
Hauptverfasser: MELVILLE IAN D, SHAW THOMAS M, LANDERS WILLIAM F, ZHU HUILONG, GRIESEMER JOHN A, FAROOQ MUKTA G
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A structure to prevent propagation of a crack into the active region of a 3D integrated circuit, such as a crack initiated by a flaw at the periphery of a thinned substrate layer or a bonding layer, and methods of forming the same is disclosed.