SILVER-CONTAINING POWDER, METHOD FOR PRODUCING THE SAME, CONDUCTIVE PASTE USING THE SAME, AND PLASTIC SUBSTRATE

The present invention relates to powder containing silver nanoparticles having an average particle size of 2 to 50 nm in an amount of 95% or more by mass and to applications of the powder. Silver-containing powder containing the silver nanoparticles is obtained by reducing a silver compound in the p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LEE SEUNG TAEG, JIN REN-HUN, TAKAHASHI AKEO, MATSUKI KOICHIRO, KAWAMURA KAORI, KAJII TOMOYO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASTING CONDUCTORS ELECTRICITY INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES NANOTECHNOLOGY PERFORMING OPERATIONS POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	The present invention relates to powder containing silver nanoparticles having an average particle size of 2 to 50 nm in an amount of 95% or more by mass and to applications of the powder. Silver-containing powder containing the silver nanoparticles is obtained by reducing a silver compound in the presence of a compound obtained by bonding polyethylene glycol to polyethyleneimine having a certain molecular weight and then by performing a concentration step and a drying step. A plastic substrate is obtained by directly applying a conductive paste that uses the powder on a plastic substrate and by performing drying.