PROCESS FOR BRAZING WIDE GAPS

A method for repairing wider gaps in a substrate of a component by brazing at a brazing temperature is provided. Filler material and solder are prevented from separating in that, in a two-stage process, first the filler material and then the solder are applied to the wider gap. The powder does not m...

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Bibliographische Detailangaben
Hauptverfasser:	KRUSCH CLAUS, HEINECKE BRIGITTE, NEUHAUS MARGARETE, VOSBERG VOLKER, GALIC RAOUL
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method for repairing wider gaps in a substrate of a component by brazing at a brazing temperature is provided. Filler material and solder are prevented from separating in that, in a two-stage process, first the filler material and then the solder are applied to the wider gap. The powder does not melt at the brazing temperature and the filler metal does melt at the brazing temperature.