LOW PROFILE COMPUTER PROCESSOR RETENTION DEVICE

A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also inclu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAMATH VINOD, JENSEN DAVID J, KERRIGAN BRIAN M, GALLARELLI PAT
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.