PACKAGE INCLUDING AN INTERPOSER HAVING AT LEAST ONE TOPOLOGICAL FEATURE

Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having an interposer including at least one topological feature, such as a depression in a surface of the interposer, a die coupled to the surface of the interposer, and an enca...

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Bibliographische Detailangaben
Hauptverfasser: ESKILDSEN STEVEN, RAMAMOORTHY ARAVIND
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having an interposer including at least one topological feature, such as a depression in a surface of the interposer, a die coupled to the surface of the interposer, and an encapsulant material formed over the die and the interposer, and disposed in the at least one depression to resist movement of the encapsulant material relative to the interposer. Other embodiments may be described and claimed.