WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP

WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP

In a wafer polishing apparatus, the height of the wheel tip can be adjusted. The wafer polishing apparatus includes a wheel tip constructed and arranged to be in direct contact with a wafer; a spindle shaft configured to receive power to enable rotation of the wheel tip; a wheel shank positioned at...

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Hauptverfasser: ROH JUNG-HYUN, KIM HEUI-SEOG, SIN WHA-SU, HAN JUN-SOO
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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creator ROH JUNG-HYUN
KIM HEUI-SEOG
SIN WHA-SU
HAN JUN-SOO
description In a wafer polishing apparatus, the height of the wheel tip can be adjusted. The wafer polishing apparatus includes a wheel tip constructed and arranged to be in direct contact with a wafer; a spindle shaft configured to receive power to enable rotation of the wheel tip; a wheel shank positioned at a lower part of the spindle shaft and supporting the wheel tip, the wheel tip not being directly fixed thereto; and a moving shaft having a first side on which the wheel tip is mounted and an opposite side to which the spindle shaft is connected, and relatively movable with respect to the spindle shaft.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2011124273A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2011124273A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2011124273A13</originalsourceid><addsrcrecordid>eNrjZLAOd3RzDVII8PfxDPbw9HNXcAwIcAxyDAkNVnDzD1JwdPEKDQ4BiXu4erp7hCj4uymEe7i6-iiEeAbwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjA0NDQyMTI3NjR0Nj4lQBAH2vKhc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP</title><source>esp@cenet</source><creator>ROH JUNG-HYUN ; KIM HEUI-SEOG ; SIN WHA-SU ; HAN JUN-SOO</creator><creatorcontrib>ROH JUNG-HYUN ; KIM HEUI-SEOG ; SIN WHA-SU ; HAN JUN-SOO</creatorcontrib><description>In a wafer polishing apparatus, the height of the wheel tip can be adjusted. The wafer polishing apparatus includes a wheel tip constructed and arranged to be in direct contact with a wafer; a spindle shaft configured to receive power to enable rotation of the wheel tip; a wheel shank positioned at a lower part of the spindle shaft and supporting the wheel tip, the wheel tip not being directly fixed thereto; and a moving shaft having a first side on which the wheel tip is mounted and an opposite side to which the spindle shaft is connected, and relatively movable with respect to the spindle shaft.</description><language>eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110526&amp;DB=EPODOC&amp;CC=US&amp;NR=2011124273A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110526&amp;DB=EPODOC&amp;CC=US&amp;NR=2011124273A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ROH JUNG-HYUN</creatorcontrib><creatorcontrib>KIM HEUI-SEOG</creatorcontrib><creatorcontrib>SIN WHA-SU</creatorcontrib><creatorcontrib>HAN JUN-SOO</creatorcontrib><title>WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP</title><description>In a wafer polishing apparatus, the height of the wheel tip can be adjusted. The wafer polishing apparatus includes a wheel tip constructed and arranged to be in direct contact with a wafer; a spindle shaft configured to receive power to enable rotation of the wheel tip; a wheel shank positioned at a lower part of the spindle shaft and supporting the wheel tip, the wheel tip not being directly fixed thereto; and a moving shaft having a first side on which the wheel tip is mounted and an opposite side to which the spindle shaft is connected, and relatively movable with respect to the spindle shaft.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAOd3RzDVII8PfxDPbw9HNXcAwIcAxyDAkNVnDzD1JwdPEKDQ4BiXu4erp7hCj4uymEe7i6-iiEeAbwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjA0NDQyMTI3NjR0Nj4lQBAH2vKhc</recordid><startdate>20110526</startdate><enddate>20110526</enddate><creator>ROH JUNG-HYUN</creator><creator>KIM HEUI-SEOG</creator><creator>SIN WHA-SU</creator><creator>HAN JUN-SOO</creator><scope>EVB</scope></search><sort><creationdate>20110526</creationdate><title>WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP</title><author>ROH JUNG-HYUN ; KIM HEUI-SEOG ; SIN WHA-SU ; HAN JUN-SOO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2011124273A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ROH JUNG-HYUN</creatorcontrib><creatorcontrib>KIM HEUI-SEOG</creatorcontrib><creatorcontrib>SIN WHA-SU</creatorcontrib><creatorcontrib>HAN JUN-SOO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ROH JUNG-HYUN</au><au>KIM HEUI-SEOG</au><au>SIN WHA-SU</au><au>HAN JUN-SOO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP</title><date>2011-05-26</date><risdate>2011</risdate><abstract>In a wafer polishing apparatus, the height of the wheel tip can be adjusted. The wafer polishing apparatus includes a wheel tip constructed and arranged to be in direct contact with a wafer; a spindle shaft configured to receive power to enable rotation of the wheel tip; a wheel shank positioned at a lower part of the spindle shaft and supporting the wheel tip, the wheel tip not being directly fixed thereto; and a moving shaft having a first side on which the wheel tip is mounted and an opposite side to which the spindle shaft is connected, and relatively movable with respect to the spindle shaft.</abstract><oa>free_for_read</oa></addata></record>
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T08%3A09%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ROH%20JUNG-HYUN&rft.date=2011-05-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2011124273A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true