WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP
In a wafer polishing apparatus, the height of the wheel tip can be adjusted. The wafer polishing apparatus includes a wheel tip constructed and arranged to be in direct contact with a wafer; a spindle shaft configured to receive power to enable rotation of the wheel tip; a wheel shank positioned at...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | In a wafer polishing apparatus, the height of the wheel tip can be adjusted. The wafer polishing apparatus includes a wheel tip constructed and arranged to be in direct contact with a wafer; a spindle shaft configured to receive power to enable rotation of the wheel tip; a wheel shank positioned at a lower part of the spindle shaft and supporting the wheel tip, the wheel tip not being directly fixed thereto; and a moving shaft having a first side on which the wheel tip is mounted and an opposite side to which the spindle shaft is connected, and relatively movable with respect to the spindle shaft. |
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