ULTRASONIC PROBE HAVING HEAT SINK

ULTRASONIC PROBE HAVING HEAT SINK

The present invention provides an ultrasonic probe which includes a heat sink (150) provided in a rear layer (140) to dissipate heat. The heat sink is coupled to a rear surface (141) of the rear layer such that contact area there between are increased. The heat sink includes a plurality of heat cond...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: RHIM SUNG MIN
Format: Patent
Sprache:eng
Schlagworte:
BLASTING
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
HEAT EXCHANGE IN GENERAL
HEATING
LIGHTING
MECHANICAL ENGINEERING
WEAPONS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention provides an ultrasonic probe which includes a heat sink (150) provided in a rear layer (140) to dissipate heat. The heat sink is coupled to a rear surface (141) of the rear layer such that contact area there between are increased. The heat sink includes a plurality of heat conductive protrusions (151) on one surface thereof. The heat conductive protrusions are inserted into respective heat conductive depressions (142) formed in the rear layer. Each heat conductive depression has a shape corresponding to the respective heat conductive protrusion. Preferably, each heat conductive protrusion has a bar shape.