COOLING STRUCTURE FOR A TEST DEVICE, AND A METHOD FOR TESTING A DEVICE

COOLING STRUCTURE FOR A TEST DEVICE, AND A METHOD FOR TESTING A DEVICE

An exemplary embodiment of the present invention aims at providing a cooling structure for a test device which has sufficient cooling performance and can reduce the size of the heat sink. The cooling structure for a test device has first and second plates, a cover with a hole on the first plate, and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MATSUZAWA HAJIME
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:An exemplary embodiment of the present invention aims at providing a cooling structure for a test device which has sufficient cooling performance and can reduce the size of the heat sink. The cooling structure for a test device has first and second plates, a cover with a hole on the first plate, and a heat sink attached to the cover. When the vacuum suction is applied in a test space which is formed between the first and the second plates, air is drawn through the hole of the cover and applied onto the heat sink.