THERMALLY ACTIVATED ADHESIVE AND FIXTURE FOR IMPROVING REGISTRATION ACCURACY BETWEEN ASSEMBLED PARTS

This is directed to a method for assembling components using a thermally activated adhesive. Two components of an electronic device housing can be coupled as part of the electronic device assembly. At least one of the two components can be thermally conductive. To use a thermally conductive adhesive to couple the components, the components can be placed in a fixture, and the adhesive between the components. The fixture can then be heated such that heat from the fixture is conducted through the thermally conductive component and into the adhesive. The adhesive can flow and propagate between the components. When the adhesive layer has flowed into an adequate layer, the fixture can be cooled such that heat can be removed from the adhesive through the thermally conductive component. The adhesive can harden and secure the components to each other.