COMPOSITION COMPRISING POLYOLS

Heat curable resin compositions include at least one phenol-glyoxylate resin (PG resin) and at least one polyol, wherein preferably the ratio of OH from the polyol to COOH from the PG resin is from 0.01:1 to 1:1.2.

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Bibliographische Detailangaben
Hauptverfasser:	VAN BENTHEM RUDOLFUS ANTONIUS THEODORUS MARIA, JANSSEN MARK MARTINUS MARIA, BOONEN JOZEF JOHANNES CATHERINA JACOBUS
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Heat curable resin compositions include at least one phenol-glyoxylate resin (PG resin) and at least one polyol, wherein preferably the ratio of OH from the polyol to COOH from the PG resin is from 0.01:1 to 1:1.2.