WAFER BACK SIDE GRINDING PROCESS

A wafer back side grinding process. A workpiece comprising a first assembly having a first semiconductor wafer and a second assembly having a second semiconductor wafer is provided. A first back side of the first semiconductor wafer is grinded by using the second assembly as a carrier. Thereafter, a...

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Bibliographische Detailangaben
1. Verfasser:	CHEN JENUNG
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	A wafer back side grinding process. A workpiece comprising a first assembly having a first semiconductor wafer and a second assembly having a second semiconductor wafer is provided. A first back side of the first semiconductor wafer is grinded by using the second assembly as a carrier. Thereafter, a second back side of the second semiconductor wafer is grinded.