BARRIER COATING WITH REDUCED PROCESS TIME

The present techniques provide systems and methods for protecting electronic devices such as organic light emitting devices (OLEDs) from adverse environmental effects using a thin film encapsulation with reduced process time. In some embodiments, the process time of forming a graded barrier over the...

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Bibliographische Detailangaben
Hauptverfasser:	SCHERER BRIAN JOSEPH, DALAKOS GEORGE THEODORE, ERLAT AHMET GUN
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PLASMA TECHNIQUE PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	The present techniques provide systems and methods for protecting electronic devices such as organic light emitting devices (OLEDs) from adverse environmental effects using a thin film encapsulation with reduced process time. In some embodiments, the process time of forming a graded barrier over the OLED structure may take less than 5 minutes, and may result in substantially similar barrier properties as those of metal and epoxy sealants and/or typical thin film encapsulations. The process time of forming the barrier may be reduced by increasing deposition rates for organic and/or inorganic materials, reducing the thicknesses of organic and/or inorganic layers, and/or varying the number of zones in the barrier.