SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME

SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME

A semiconductor package includes a carrier substrate having thereon at least one bond finger; a semiconductor die mounted on a top surface of the carrier substrate; at least one active bond pad disposed on the semiconductor die; at least one dummy bond pad disposed on the semiconductor die; a first...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: CHEN JENUNG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package includes a carrier substrate having thereon at least one bond finger; a semiconductor die mounted on a top surface of the carrier substrate; at least one active bond pad disposed on the semiconductor die; at least one dummy bond pad disposed on the semiconductor die; a first bonding wire extending between the at least one active bond pad and the at least one dummy bond pad; a second bonding wire extending between the at least one dummy bond pad and the at least one bond finger; and a molding compound encapsulating at least the semiconductor die.