METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A high positional accuracy of a semiconductor chip is attained to stabilize the quality of a semiconductor device. In a die bonding process during assembly of an SIP, a microcomputer chip not required to have a high positional accuracy is picked up with a surface non-contact type collet and is die-bonded onto a first chip mounting portion, thereafter, an ASIC chip required to have a high positional accuracy is picked up with a surface contact type collet and die-bonded onto a second chip mounting portion. By thus using two types of collets properly, not only a high positional accuracy of the ASIC chip which has been die-bonded with the surface contact type collet is attained, but also the quality of the SIP is stabilized.