METHOD FOR BONDING CERAMIC MATERIALS

Systems and methods for bonding ceramic materials are disclosed herein. In various embodiments, a process is provided comprising the steps of disposing a bonding material at least partially adjacent to a surface of a first silicon carbide component and at least partially adjacent to a surface of a s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MOCK M. ROBERT, PETERSON JOHN ROGER
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Systems and methods for bonding ceramic materials are disclosed herein. In various embodiments, a process is provided comprising the steps of disposing a bonding material at least partially adjacent to a surface of a first silicon carbide component and at least partially adjacent to a surface of a second silicon carbide component, and bonding said first silicon carbide component to said second silicon carbide component by heating, wherein said bonding material comprises vanadium or titanium.