SUBSTRATE FOR SEMICONDUCTOR DEVICE, RESIN-SEALED SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAID SUBSTRATE FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAID RESIN-SEALED SEMICONDUCTOR DEVICE

A substrate for a semiconductor device includes: a base plate, a plurality of external terminal portions respectively arranged in a plane on the base plate and having external terminal faces respectively facing the base plate; a plurality of internal terminal portions, respectively arranged in the p...

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Bibliographische Detailangaben
Hauptverfasser: ISHIKAWA SHOZO, IKENAGA CHIKAO
Format: Patent
Sprache:eng
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Zusammenfassung:A substrate for a semiconductor device includes: a base plate, a plurality of external terminal portions respectively arranged in a plane on the base plate and having external terminal faces respectively facing the base plate; a plurality of internal terminal portions, respectively arranged in the plane on the base plate and having internal terminal faces respectively facing an opposite side to the base plate. The internal terminal portions are connected with the external terminal portions via wiring portions, respectively. A part of the external terminal portions are located on the base plate in a predetermined arrangement area in which a semiconductor element is arranged.