ADHESIVE COMPOSITIONS AND METHODS FOR USE IN FAILURE ANALYSIS

Thermally curable adhesive compositions and method for failure analysis in micro-fluid ejections heads. The adhesive composition may be provided by a composition including from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin, from about 0.1 to about 30.0 percent by we...

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Bibliographische Detailangaben
Hauptverfasser:	HOLT, JR. GARY ANTHONY, GRAHAM DAVID CHRISTOPHER, WEAVER SEAN TERRENCE, PROVENCE JOEL PAUL, WELLS RICHARD DONOVAN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL DYES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Thermally curable adhesive compositions and method for failure analysis in micro-fluid ejections heads. The adhesive composition may be provided by a composition including from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin, from about 0.1 to about 30.0 percent by weight of at least one thermal curative agent, and from about 0.0 to about 5.0 percent by weight filler, from about 0.1 to about 10.0 percent by weight fluorescent pigment. Upon curing, the adhesive composition exhibits a relatively low shear modulus.