Multi-Connect Lead

This disclosure describes a multi-connect lead providing multiple connections using one external pin. In one embodiment, a lead frame for a lead-frame-based chip package includes a multi-connect lead that uses one external pin and enables multiple electrical connections to an integrated circuit die.

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Bibliographische Detailangaben
Hauptverfasser:	LIU CHENGLIN, CHANG XIAOTING, NGO THOMAS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	This disclosure describes a multi-connect lead providing multiple connections using one external pin. In one embodiment, a lead frame for a lead-frame-based chip package includes a multi-connect lead that uses one external pin and enables multiple electrical connections to an integrated circuit die.