PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of...

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Bibliographische Detailangaben
Hauptverfasser:	INOUE MASAMI, YAMAUCHI DAISUKE, OOSAWA TETSUYA, HONJO MITSURU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.