ADHESIVE SHEET FOR DICING SEMICONDUCTOR WAFER AND METHOD FOR DICING SEMICONDUCTOR WAFER USING THE SAME

An adhesive sheet for dicing a semiconductor wafer having a laminate comprises; a base film, an intermediate layer and an adhesive layer, the intermediate layer is formed by a thermoplastic resin having a melting point of 50 to 100° C.; and the base film has a higher melting point than the intermedi...

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Hauptverfasser: KAWASHIMA NORIYOSHI, SUGIMURA TOSHIMASA, TAKAHASHI TOMOKAZU, ASAI FUMITERU
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creator KAWASHIMA NORIYOSHI
SUGIMURA TOSHIMASA
TAKAHASHI TOMOKAZU
ASAI FUMITERU
description An adhesive sheet for dicing a semiconductor wafer having a laminate comprises; a base film, an intermediate layer and an adhesive layer, the intermediate layer is formed by a thermoplastic resin having a melting point of 50 to 100° C.; and the base film has a higher melting point than the intermediate layer as well as a method for dicing a semiconductor wafer comprises the steps of: adhering the adhesive sheet according to the above to a corrugated surface of a semiconductor wafer, and dicing the semiconductor wafer.
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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
title ADHESIVE SHEET FOR DICING SEMICONDUCTOR WAFER AND METHOD FOR DICING SEMICONDUCTOR WAFER USING THE SAME
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