ADHESIVE SHEET FOR DICING SEMICONDUCTOR WAFER AND METHOD FOR DICING SEMICONDUCTOR WAFER USING THE SAME

An adhesive sheet for dicing a semiconductor wafer having a laminate comprises; a base film, an intermediate layer and an adhesive layer, the intermediate layer is formed by a thermoplastic resin having a melting point of 50 to 100° C.; and the base film has a higher melting point than the intermedi...

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Bibliographische Detailangaben
Hauptverfasser: KAWASHIMA NORIYOSHI, SUGIMURA TOSHIMASA, TAKAHASHI TOMOKAZU, ASAI FUMITERU
Format: Patent
Sprache:eng
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Zusammenfassung:An adhesive sheet for dicing a semiconductor wafer having a laminate comprises; a base film, an intermediate layer and an adhesive layer, the intermediate layer is formed by a thermoplastic resin having a melting point of 50 to 100° C.; and the base film has a higher melting point than the intermediate layer as well as a method for dicing a semiconductor wafer comprises the steps of: adhering the adhesive sheet according to the above to a corrugated surface of a semiconductor wafer, and dicing the semiconductor wafer.