METHOD OF INTEGRATED CIRCUIT CHIP FABRICATION AND PROGRAM PRODUCT THEREFOR

METHOD OF INTEGRATED CIRCUIT CHIP FABRICATION AND PROGRAM PRODUCT THEREFOR

A method of physical design for integrated circuit (IC) chip fabrication, physical design system and program product therefor. A design shape is fragmented into segments for Optical Proximity Correction (OPC) and a harmonic mean of the segments is determined. Electrical intent is determined for the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SINGH RAMA N, TIEN CHAO YI, HAN GENG, HENG FOOK-LUEN, LEE JIN FUW
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Beschreibung
Zusammenfassung:A method of physical design for integrated circuit (IC) chip fabrication, physical design system and program product therefor. A design shape is fragmented into segments for Optical Proximity Correction (OPC) and a harmonic mean of the segments is determined. Electrical intent is determined for the shape and a harmonic mean is determined for the segments. Segments may be moved based on a effect on the harmonic mean from moving the segments, measured using a harmonic mean cost function. Finally segmented shapes are passed to OPC.