LAMINATED FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

The present invention provides a laminated film which includes a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer, and a die-adhering layer laminated on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, the laminated film being for use in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KAMIYA KATSUHIKO, OOTAKE HIRONAO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention provides a laminated film which includes a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer, and a die-adhering layer laminated on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, the laminated film being for use in a production step of a semiconductor device, in which the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet contains a peeling force-controlling component capable of lowering the pressure-sensitive adhesive force between the pressure-sensitive adhesive sheet and the die-adhering layer.