Aluminum-Aluminum Nitride composite material, manufacturing method thereof and heat exchanger including the same

Molten aluminum is heated in the range of 900° C. to 1300° C. under a nitrogen atmosphere using magnesium as an auxiliary agent to form aluminum nitride directly on the molten aluminum and bond the aluminum nitride to the aluminum so that an Al-AlN composite material is formed. Because aluminum nitr...

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1. Verfasser:	AOKI YUUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HEAT EXCHANGE IN GENERAL HEATING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LIGHTING MECHANICAL ENGINEERING METALLURGY PERFORMING OPERATIONS PRETREATMENT OF RAW MATERIALS PRODUCTION AND REFINING OF METALS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WEAPONS
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Beschreibung
Zusammenfassung:	Molten aluminum is heated in the range of 900° C. to 1300° C. under a nitrogen atmosphere using magnesium as an auxiliary agent to form aluminum nitride directly on the molten aluminum and bond the aluminum nitride to the aluminum so that an Al-AlN composite material is formed. Because aluminum nitride power needs not to be sintered at high temperature equal to or higher than 1900° C., the Al-AlN composite material can be formed at low temperature in the range of 900° C. to 1300° C. compared with the high temperature equal to or higher than 1900° C., and thereby the high-density aluminum nitride can be obtained.