MANUFACTURING METHOD OF ADVANCED QUAD FLAT NON-LEADED PACKAGE

MANUFACTURING METHOD OF ADVANCED QUAD FLAT NON-LEADED PACKAGE

The manufacturing method of advanced quad flat non-leaded packages includes performing a pre-cutting process prior to the backside etching process for defining the contact terminals. The pre-cutting process ensures the isolation of individual contact terminals and improves the package reliability.

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Bibliographische Detailangaben
Hauptverfasser: CHIANG PO-SHING, CHENG WEI-LUN, HU PINGNG, CHIEN PAO-HUEI CHANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The manufacturing method of advanced quad flat non-leaded packages includes performing a pre-cutting process prior to the backside etching process for defining the contact terminals. The pre-cutting process ensures the isolation of individual contact terminals and improves the package reliability.