COPPER FILLING-UP METHOD

[Problem to be Solved] To provide a method of well filling copper in a non-through hole on a conductivity-rendered substrate by using a copper plating bath containing fewer additives. [Means for Solving the Problem] A method of filling copper in a non-through hole on a substrate that has been treate...

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Bibliographische Detailangaben
Hauptverfasser:	KONDO KAZUO, KURI HIDEYUKI, BUNYA MASARU, OKAMOTO NAOKI, TAKEUCHI MINORU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SPRAYING OR ATOMISING IN GENERAL TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	[Problem to be Solved] To provide a method of well filling copper in a non-through hole on a conductivity-rendered substrate by using a copper plating bath containing fewer additives. [Means for Solving the Problem] A method of filling copper in a non-through hole on a substrate that has been treated to render it conductive, which comprises plating said substrate in an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid and a filling additive that is a polymer having the activities of both of a brightener and a leveler.