NOVEL RESIN COMPOSITION, COMPOSITE MATERIAL CONTAINING THE SAME AND USE OF THE COMPOSITE MATERIAL

Disclosed is a resin composition which can firmly bond a metal with a molding material, a composite material including the resin composition and use of the composite material. The resin composition of the present invention includes: an organic compound having at least one secondary thiol group per m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KITAMURA KYOJI, NAKAMURA MASAKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed is a resin composition which can firmly bond a metal with a molding material, a composite material including the resin composition and use of the composite material. The resin composition of the present invention includes: an organic compound having at least one secondary thiol group per molecule; and a curable compound having at least one hydroxyl group per molecule.