Suspension with additional bonding pads, head gimbal assembly and disk drive unit with the same

A suspension for a head gimbal assembly comprises a flexure having a plurality of electrical traces formed thereon, a plurality of first bonding pads formed on a first surface of the flexure and at least one second bonding pad formed on a second surface of the flexure opposite the first surface. The first bonding pads and the at least one second bonding pad are electrically connected with the electrical traces and adapted to electrically connect to a slider of the head gimbal assembly. The invention also discloses a head gimbal assembly and a disk drive unit with the same.