Interconnect for Printed Board Assembly

A printed board includes a base printed board including a trace; an electronic component operably associated with the base printed board; and a dielectric connector build-up extending from the base printed board. The dielectric connector build-up defines a via. The printed board further includes a l...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	DUPRIEST CHARLES DONALD, PHILLIPS ALAN L, OLIVER GLEN C, POLK SAMUEL O, BYRD THOMAS E
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A printed board includes a base printed board including a trace; an electronic component operably associated with the base printed board; and a dielectric connector build-up extending from the base printed board. The dielectric connector build-up defines a via. The printed board further includes a land attachment site disposed in the via. The land attachment site extends through the dielectric connector build-up and into the base printed board. The land attachment site is electrically coupled with the trace and is configured to be electrically coupled to another printed board by one of an electrically conductive compound and a flowed solder ball.