THERMOPLASTIC RESIN COMPOSITION AND RESIN MOLDING

The present invention provides a thermoplastic resin composition producing an extremely small amount of outgas and providing a molded article having excellent antistaticity. The present thermoplastic resin composition comprises a thermoplastic resin and is characterized in that the amount of outgas...

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Bibliographische Detailangaben
1. Verfasser:	SUMIMOTO NORIFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING GENERAL PROCESSES OF COMPOUNDING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HANDLING THIN OR FILAMENTARY MATERIAL MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a thermoplastic resin composition producing an extremely small amount of outgas and providing a molded article having excellent antistaticity. The present thermoplastic resin composition comprises a thermoplastic resin and is characterized in that the amount of outgas is 1500 μg/g or less. The composition may comprise a surface resistivity reducing substance in an amount of 0.1 to 70 parts by mass relative to 100 parts by mass of the thermoplastic resin. The present invention is suitable to a composition comprising a styrenic resin as the thermoplastic resin. The surface resistivity reducing substrate is preferably a polyamide elastomer comprising a hard segment formed of polyamide 12 and a soft segment formed of poly(alkylene oxide)glycol. The polyamide elastomer preferably has a refractive index of 1.5 to 1.53, a melting point of 130 to 160° C., a solution viscosity of 1.35 to 1.70 and a surface resistivity of 1×108 to 1×1011 .