Heat sink

A heat sink includes a radiator fin for dissipating heat of an electronic device provided on a printed board; a plurality of radiator fins included in the heat sink is formed in an arbitrary diameter size; and the radiator fins are connected to each other by inserting a pair of fastening screws thro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JOKO KENJI, IZUNO TAKAHARU, SAWADA AKIRA, FUJII MINORU, MATSUMOTO HIDEAKI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A heat sink includes a radiator fin for dissipating heat of an electronic device provided on a printed board; a plurality of radiator fins included in the heat sink is formed in an arbitrary diameter size; and the radiator fins are connected to each other by inserting a pair of fastening screws through a through hole provided on each of the radiator fins, and a tip end of the fastening screws is screwed and fastened to a screw hole of a base heat sink fixed on the upper surface of an electronic device.