METHOD FOR CONTROLLING PROCESS GAS CONCENTRATION

A method for controlling process gas concentration for treatment of substrates in a process space in which a medium is evaporated in a bubbler by bubbles of a carrier gas passed through the medium is achieved by producing a stipulated constant internal pressure in the bubbler and subsequent introduc...

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Bibliographische Detailangaben
Hauptverfasser:	VOELLER HANS ULRICH, HARTUNG ROBERT MICHAEL, MUELLER ROLF
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A method for controlling process gas concentration for treatment of substrates in a process space in which a medium is evaporated in a bubbler by bubbles of a carrier gas passed through the medium is achieved by producing a stipulated constant internal pressure in the bubbler and subsequent introduction of the carrier gas into the bubbler with simultaneous temperature control of the medium being evaporated within the bubbler to set a stipulated vapor pressure.