METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
A method of manufacturing a semiconductor module is provided. A semiconductor package is formed, having one or more plate units which are bent by heat. The semiconductor package is aligned on a module substrate, and connection members are disposed between the semiconductor package and the module sub...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method of manufacturing a semiconductor module is provided. A semiconductor package is formed, having one or more plate units which are bent by heat. The semiconductor package is aligned on a module substrate, and connection members are disposed between the semiconductor package and the module substrate. Heat is applied to the plate units and the connection members to extend a distance between the module substrate and the semiconductor package, and connection patterns are formed. The height of the connection patterns is larger than that of the connection members. |
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