NONCONDUCTIVE ADHESIVE COMPOSITION AND FILM AND METHODS OF MAKING

To provide a nonconductive adhesive film, for electrically connecting a flexible printed circuit board to a circuit board, which is superior in both storage stability and curability and which suppresses the formation of air bubbles at the time of press bonding. A nonconductive adhesive film substant...

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Bibliographische Detailangaben
Hauptverfasser:	YASUI HIDEAKI, KAWATE KOHICHIRO, ARITA HIROKO, SATO YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a nonconductive adhesive film, for electrically connecting a flexible printed circuit board to a circuit board, which is superior in both storage stability and curability and which suppresses the formation of air bubbles at the time of press bonding. A nonconductive adhesive film substantially comprising a heat-curable epoxy resin, a latent curing agent, and organic elastic fine particles of an average particle size of approximately 1 μm or less, a film being formed by aggregation of the organic elastic fine particles, is provided.