COMPOSITION FOR CHEMICAL MECHANICAL POLISHING

Provided is a composition for use in chemical mechanical polishing. The composition includes an amino acid and its derivatives, a surfactant, and an additive that increases the swelling of polishing particles.

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Bibliographische Detailangaben
Hauptverfasser:	LIM YOUNG-SAM, KANG YUN-DEOK, KIM HYUN-JOON, LEE JI-SUNG, LEE SONG-YI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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Beschreibung
Zusammenfassung:	Provided is a composition for use in chemical mechanical polishing. The composition includes an amino acid and its derivatives, a surfactant, and an additive that increases the swelling of polishing particles.