Apparatus and method for treating substrate

An apparatus and method for treating a substrate are provided. The apparatus includes a load port, an index module, a first buffer module, a coating/developing module, a second buffer module, a pre/post-exposure treatment module, and an interface module, which are sequentially arranged in a directio...

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Bibliographische Detailangaben
Hauptverfasser:	GO JAESEUNG, CHOI JINYOUNG, NOH HYOUNG RAE, KIM DONG HO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	An apparatus and method for treating a substrate are provided. The apparatus includes a load port, an index module, a first buffer module, a coating/developing module, a second buffer module, a pre/post-exposure treatment module, and an interface module, which are sequentially arranged in a direction. The coating/developing module includes a coating module and a developing module, which are arranged in different layers. The pre/post-exposure treatment module includes a pre-treatment module and a post-treatment module, which are disposed at different layers. The pre-treatment module coats a protective layer on the wafer before an exposure process. The post-treatment module performs a wafer cleaning process and a post-exposure bake process after the exposure process. A robot for transferring the wafer is disposed in each of the pre-treatment and post-treatment modules.