THREE-DIMENSIONAL PACKAGE

THREE-DIMENSIONAL PACKAGE

A three-dimensional package includes a carrier, a first die mounted on a first surface of the carrier, and a second die stacked on the first die. The first die includes first bond pads and second bond pads juxtaposed in separate two rows within a central region of the first die. The package further...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: CHEN JENUNG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A three-dimensional package includes a carrier, a first die mounted on a first surface of the carrier, and a second die stacked on the first die. The first die includes first bond pads and second bond pads juxtaposed in separate two rows within a central region of the first die. The package further includes first bond fingers disposed on the first surface along a first side of the carrier, and second bond fingers along a second side opposite to the first side. A first bond wire is bonded to one of the first bond pads and extends to one the first bond fingers. The first bond wire overlies the row of the second bond pads. A second bond wire is bonded to one of the second bond pads and extends to one the second bond fingers. The second bond wire overlies the row of the first bond pads.